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We are a golden PCB manufacturer which obtained ISO9001, ISO14000, QS9000 and UL,we could prodive you any rigid board with any quantity
(Sample, small batch, or big volume) and the quickest lead-time.
Production Line
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L/Q(Liquid S/M) |
Our PCB can be used for a wide range of applications in telecommunications,instrumentation,application,automobile products,computers and so on.
What we can offer
-Rigid PCB( Single-sided PCB,Double-sided PCB,Multi-layer PCB-up to 30layers)
-Rigid-flexible PCB(1 to 16layers)
-Flexible PCB(1 to 8layers)
-HDI PCB
-All kinds of high class PCBs
PCB material we can use:FR1, FR2, HB,CEM1,CEM3, FR4,High TG/CTI FR4,Halogen Free,Rogers,Aluminium based, Leadfree compatible, Hi Frequency.
Our PCB Products
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4 layers
FR4,TG170, 1.60mm,
1/1/1/1 oz
Immersion gold
Au:0.05um.min
Min hole size 0.25mm,
Min trace width/space:0.127/0.127mm |
8 layers
FR4 ,TG150, 1.60mm
1/1/1/1/1/1/1/1oz
Immersion gold
Au:0.05um.min
Min hole size :0.20mm
Min trace width/space:0.10/0.10mm
Impedance control |
6 layers
FR4 ,TG170,1.60mm
1/1/1/1 oz
HAL Leadfree
Min hole size 0.20mm
Min trace width/space:0.10/0.10mm
Impedance control |
4 layers
FR4,TG130,1.60mm
2/2/2/2 OZ
Immersion gold
Au:0.05um.min
Min hole size 0.30mm
Min trace width /space: 0.20/0.20mm |
10 layers
FR4,TG170,1.60mm
1/1/1/1/1/1/1
/1/1/1 oz
Immersion gold
Au 0.05um.min
Min hole size 0.15mm
Blind via L1-L2,L9-L10
Min trace width/space:0.076/0.076mm
Solder mask red |
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8 layers
FR4,TG150, 1.60mm
1/1/1/1/1/1/1/1 OZ
Immersion gold
Au 0.05um.min
Min hole size :0.20mm
Impedance control
Min trace width/space :0.10/0.10mm |
8 layers
FR4 ,TG170, 1.60mm
1/1/1/1/1/1/1/1 OZ
OSP
Min hole size 0.10mm
Blind via L1-L2,L7-L8,Burried via L2-L3
Impedance control
Min trace width/space :0.076/0.076mm |
4 layers Flex-rigid + stifferner pcb
1/1/1/1 oz
Polymid
Immersion gold
Au0.05um.min
Min hole size 0.30mm
Min trace width/space :0.15/0.15mm |
4 layers
FR4,TG170, 1.60mm
3/3/3/3 OZ
Immersion gold
Au0.05um.min
Min hole size 0.25mm
Min trace width/space :0.30/0.30mm
Impedance control |
4 layers
FR4 ,TG130,1.60mm
1/1/1/1 OZ
Immersion gold
Au0.05um.min
Min hole size 0.25mm
Min trace width/space :0.12/0.12mm |
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HDI technology for handhold equipment:
Description: 1+4+1HDI(1 rank)
Min line space(mm):0.11
Min line width(mm):0.125
Min hole diameter(mm):0.1
Thickness(mm):0.55
Type: PTH(SMT,DIP)
Base laminate materials: FR-4 and RCC
Surface finishes: Im Au+OSP |
High Frequency Application for micro-wave:
Description: 3-layer PCB
Min line space(mm):0.2
Min line width(mm):0.2
Min hole diameter(mm):0.3
Thickness(mm):3.0
Base laminate materials: Taconic TLX-8
Surface finishes: Im Au |
16 layer blind /
buried via PCB,
thickness 3.9mm
Application: secondary power sources etc. |
12 layer 5OZ heavy Cu PCB, thickness 5mm.
Application: Secondary power source etc. |
0.5MM CSP blind / buried via PCB
Application: Blue tooth, telecom, mobile etc |
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